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| STE101P 10/100 Fast ethernet 3.3V transceiver Data Brief Feature summary IEEE802.3u 100Base-TX and IEEE802.3 10Base-T transceiver Support for IEEE802.3x flow control MII /RMII / SMII interface Auto MDIX supported Provides Full-duplex operation on both 100Mbps and 10Mbps modes Provides MLT-3 transceiver with DC restoration for Base-line wander compensation Provides loop-back modes for diagnostics Supports external transformer with turn ratio 1.414:1 on Tx/Rx side. Five LED display for operating mode and functionaliity signalling Operation from single 3.3V supply High Cable ESD tolerance Standard 64-pin QFP package pinout Industrial temperature compliant Self termination transceiver for external components and power saving Power dissipation < 200mW TQFP64 (10x10x1.4mm) Description The STE101P is a high performance Fast Ethernet physical layer interface for 10Base-T and 100Base-TX applications. It was designed with advanced CMOS technology to provide MII, RMII and SMII interfaces for easy attachment to 10/100 Media Access Controllers (MAC) and a physical media interface for 100Base-TX of IEEE802.3u and 10Base-T of IEEE802.3. The STE101P supports both half-duplex and fullduplex operation at 10 and 100 Mbps operation. Its operating mode can be set using autonegotiation, parallel detection or manual control. It also allows for the support of auto-negotiation functions for speed and duplex detection. The Automatic MDI / MDIX feature compensates for using a cross over cable. With Auto MDIX, the STE101P automatically detects what is on the other end of the network cable and switches the TX & RX pins accordingly. Applications Switches/Routers/Hubs Nic adapters Game consoles VoIP gateways/phones Network Printers DTVs/DVD-Rs Order codes Part number E-STE101P(1) (1) E-: ECOPACK(R) (see Chapter 2) Temp range, C -40 to 85 Package TQFP64 (14x14x1.4mm) Packing Tube February 2006 Rev 1 1/5 www.st.com 5 For further information contact your local STMicroelectronics sales office. System diagram of the STE101P application STE101P 1 System diagram of the STE101P application Figure 1. System diagram of the STE101P application Serial EEPROM LEDs PCI Interface MA C Device STE101P Transformer RJ-45 Boot ROM 25 MHz Crystal 2/5 STE101P Package information 2 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. TQFP64 (10 x 10 x 1.4mm) Mechanical Data & Package Dimensions mm DIM. MIN. A A1 A2 B C D D1 D3 e E E1 E3 L L1 K ccc 0.45 11.80 9.80 0.05 1.35 0.17 0.09 11.80 9.80 12.00 10.00 7.50 0.50 12.00 10.00 7.50 0.60 1.00 0.75 12.20 10.20 0.464 0.386 12.20 10.20 1.40 0.22 TYP. MAX. 1.60 0.15 1.45 0.27 0.002 0.053 0.055 MIN. TYP. MAX. 0.063 0.006 0.057 inch OUTLINE AND MECHANICAL DATA 0.0066 0.0086 0.0106 0.0035 0.464 0.386 0.472 0.394 0.295 0.0197 0.472 0.394 0.295 0.0177 0.0236 0.0295 0.0393 0.480 0.401 0.480 0.401 0 (min.), 3.5 (min.), 7(max.) 0.080 0.0031 TQFP64 (10 x 10 x 1.4mm) D D1 A D3 A1 48 49 33 32 0.08mm ccc Seating Plane A2 B E3 E1 64 1 e 16 17 C L1 E L K TQFP64 B 0051434 E 3/5 Revision history STE101P 3 Revision history Table 1. Date 10-Feb-2006 Document revision history Revision 1 Initial release. Changes 4/5 STE101P Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 5/5 |
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